Microcontroller - 8051, 8052, OpCodes, Analog Interface.
Showing posts with label Foundry-Wafer. Show all posts
Showing posts with label Foundry-Wafer. Show all posts

Friday, May 08, 2015

Veeco - Metrology and Process Equipment

Metrology & Instrumentation, Process Equipment and Epitaxial Equipment. Advanced Research tools for life science, materials science and nanotechnology.

Veeco - Metrology and Process Equipment

Solutions for Process Equipment technologies primarily to manufacturers of high brightness light emitting diodes (LEDs) and solar cells. Supplies materials to hard disk drive (HDD) manufacturers for the production of thin film magnetic heads.

Molecular Beam Epitaxy (MBE) products which include systems and components. MBE has broad applications from power amplifiers to scientific research.

GENxplor MBE System  Veeco

GENxplor R&D MBE System

Veeco proudly introduces the GENxplor, the industry's first fully-integrated MBE system for the compound semiconductor R&D market.

Its efficient single frame design combines all vacuum hardware with on-board electronics to make it up to 40% smaller than other MBE systems, saving valuable lab space. Because the manual system is integrated on a single frame, installation time is reduced.

Veeco Instruments
1 Terminal Drive, Plainview, NY 11803, USA.

Thursday, June 27, 2013

GLOBALFOUNDRIES - Semiconductor Manufacturing Fab

The company is distributed over three continents. It has three 300mm fabs and five 200mm fabs. The major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States,

GLOBALFOUNDRIES - Semiconductor Manufacturing Fab

GlobalFoundries was created by the divestiture of the manufacturing fab of AMD and later it enhanced its global presence after the merger with Chartered Semiconductor.

"Manufacturing centers in Germany, the United States and Singapore deliver advanced technologies to market in high volume..."

Assured long term supply and innovation of 200mm technologies with scalable plug-in modules such as analog/RF, High Voltage and embedded memories.

28nm Systems-on-Chip (SoCs) design platform 

"The 28nm technologies are based on bulk silicon substrates, and are designed for a wide variety of applications from high performance such as graphics and wired networking to mobile computing and digital consumer to low power wireless mobile applications that require long battery lifetime."

GLOBALFOUNDRIES Inc.
840 N McCarthy Blvd Milpitas, CA 95035, USA

Thursday, September 13, 2012

LAPIS Semiconductor - LSI and Foundry

LAPIS Semiconductor a spin-off of the semiconductor business of Oki Electric Industry Co., Ltd. is now a member of the ROHM group.

LAPIS Semiconductor - LSI and Foundry

System and Logic LSIs, Memory Devices and optical communication devices are also part of the Product Lineup. They also have ARM-Based Microcontrollers and Support Chips for Portable Wireless Electronic Products.

Lazurite Sub-GHz - IoT

Lazurite Sub-GHz is an open platform microcomputer board with Lapis Semiconductor's 16-bit low consumption microcontroller ML620Q504.

Lazurite Sub-GHz - IoT - LAPIS Semiconductor

It includes a specific low-power (920 MHz band) technical certification acquisition module that can realize communication of hundreds of meters with low power consumption, so it is easy to realize IoT's sensor node.

Old Post of delabs
Oki Semiconductor - A full range of digital ICs from RTCs to MPUs and network devices.

"With his enterprising spirit, Kibataro Oki (1848-1906) was far ahead of his time in the late 1800s. In January 1881, convinced that the nation was about to enter the age of communications, he founded Meikosha, the origins of today's OKI."

Thursday, August 09, 2012

Winbond - Semiconductor Solutions

Winbond - Semiconductor Solutions
 
"Winbond Electronics Corporation America is a leading supplier of semiconductor memory solutions to the consumer, computer, and mobile electronics markets."

They are Specialized in Flash and SDRAM memory design, engineering and marketing.
  • Mobile RAM
  • Specialty DRAM
  • Graphics DRAM
  • Flash Memory
  • Memory Product Foundry Service
Winbond - Semiconductor Solutions

The W25X family operates up to 104MHz and supports "Dual-Output SPI", effectively doubling the clock rate to 208MHz. The W25Q family is "superset" compatible with W25X devices while adding Dual-I/O and Quad-I/O SPI for even higher performance

 Winbond Electronics Corporation America
2727 North First Street  San Jose, CA 95134 USA 

Monday, May 16, 2011

Micrel Semiconductors - Analog Mixed Ethernet and RF

Leading manufacturer of IC and Semiconductor solutions in analog, Ethernet and high bandwidth. Products include high performance analog, power, advanced mixed-signal and radio frequency semiconductors; high speed communication, clock management, Ethernet switch and physical layer transceiver integrated circuits

Micrel Semiconductors - Analog Mixed Ethernet and RF
 
The chips and devices are components of many consumer and industrial products. These are like Cellular handsets, portable and enterprise computing and networking, wide area networks and industrial equipment.
They also have a Foundry Service. In fiber optics they have Laser Diode Drivers and Optical Transceiver Mgmt. ARM based SOC's and USB products too are available.

MICRF213 QwikRadio 315 MHz Receiver

The MICRF213 functions as a super-heterodyne receiver for OOK and ASK modulation up to 7.2kbps. The down-conversion mixer also provides image rejection. All post-detection data filtering is provided on the chip.

Partial Specs
  • Up to -110dBm sensitivity, 1kbps and BER 10E-02
  • Frequency from 300MHz to 350MHz
  • Low current consumption: 3.9mA @ 315MHz,
  • Analog RSSI Output
Micrel Inc.
Founded 1978, Corporate headquarters in San Jose, California.

Address - 2180 Fortune Drive, San Jose, CA 95131, United States. - Micrel Map

Thursday, March 11, 2010

MEMS Products from Axetris Leister

Micro-technology products and sevices. MEMS based ultra compact mass flow meters and controllers, modules and systems. MEMS based broadband infrared (IR) sources.

MEMS ultra compact mass flow meters - Axetris Leister
Diode-based laser gas detection (LGD) OEM modules. Micro Optics and MEMS Services.

MEMS Products from Axetris Leister

What is MEMS Technology?

"Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology.....

MEMS and Nanotechnology Exchange

Monday, September 14, 2009

Tanner EDA - Automate and Simplify Design

Tanner EDA - Automate and Simplify Design
 
High-technology design software for ICs, analog VLSI, and Design Automation. Includes Analog/Mixed-Signal ICs, ASICs and MEMS. Schematic Capture too.
  • Simulation: T-Spice, W-Edit
  • Physical Layout: L-Edit
  • Verification: HiPer Verify
  • Parasitic Layout Extraction
MEMS R&D and Prototyping Services - Fast Turn-around from Order to Product Prototype, Low and Medium Volume Fabrication

HiPer Verify
 
A comprehensive solution for analog/mixed-signal IC design rule checking DRC and hierarchical netlist extraction.



With HiPer Verify, you can simply reference the new DRC or LVS command file from the foundry, meeting your existing standards right out of the box.

Tanner Research
825 South Myrtle Avenue, Monrovia, CA 91016 USA

Thursday, August 06, 2009

UMC - Foundry Technology - Taiwan

A leading global semiconductor foundry UMC was founded in 1980 as Taiwan's first semiconductor company.

 UMC - Foundry Technology - Taiwan

The high tech processes include 28nm poly-SiON and gate-last High-K/Metal Gate technology. Even Specialized technologies like Mixed signal/RFCMOS.

 UMC - Foundry Technology - Taiwan

"Wafers are transported automatically in a Front Opening Universal Pod (FOUP) that has a capacity of 25 wafers. In addition, lot movement is executed using Automated Material Handling System (AMHS) for interbay moves.."

Advanced Automation

UMC's Collaborative Advantage

"SoC silicon supply chain - Equipment, EDA tool, and IP vendors to work synergistically towards each customer's ..."
  • System Architecture Knowledge
  • IP and Design Methodology
  • Test and Package Solutions
UMC
No. 3, Li-Hsin 2nd Road, Hsinchu Science Park, Hsinchu, Taiwan, R.O.C.

Wednesday, August 05, 2009

MOSIS - Affordable Integrated Circuits Fabrication

MOSIS Is An Multi-Project Wafer (MPW) Integrated Circuit (IC) Fabrication Service Provider.

MOSIS - Affordable Integrated Circuits Fabrication

"MOSIS is operated by the Information Sciences Institute at the University of Southern California (USC). MOSIS merges multiple IC designs submitted by both companies and universities onto multi-project wafers (MPW) to share the cost of fabrication among multiple users."

MOSIS - Affordable Integrated Circuits Fabrication

MOSIS - Metal Oxide Semiconductor Implementation Service

MOSIS keeps the cost of fabricating    prototype quantities low by aggregating multiple designs onto one mask set. This allows customers to share overhead costs associated with mask making, wafer fabrication, and assembly.

MOSIS Design Reference

A variety of design flows (digital, analog, mixed-signal) can be used with a number of different CAD tools, technology files, design kits, libraries and IP to create designs for processes accessed by MOSIS.

MOSIS Integrated Circuit Fabrication Service
USC Information Sciences Institute, 4676 Admiralty Way, 7th floor
Marina del Rey, CA 90292-6695, USA

Monday, June 01, 2009

Amkor Technology - Semiconductor Services

A technology innovator in packaging and test solutions. The pakaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions.

They offer test services for many devices and designs that are used in Mordern day Electronic Gadgets that have application specific integrated circuits, memory devicea, and mixed signal and RF sections.

Amkor Technology - Semiconductor Services

Amkor also offers IC and Semiconductor Test Services. The also provide IC Package Design Services and complete turnkey solutions.

Amkor Flip Chip BGA (fcBGA) packages are assembled around state-of-the-art, single unit laminate or ceramic substrates.

Flip Chip BGA - Amkor Technology

This IC packaging technology is applicable for high pincount and / or high performance ASICs.

The variety of fcBGA package options allows package selection to be tailored to the specific thermal needs of the end product.

Flip Chip BGA - fcBGA

Amkor Technology
1900 South Price Road, Chandler AZ USA

Tuesday, May 05, 2009

Applied Materials - Nanomanufacturing

"A global leader in nanomanufacturing technology solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panels, solar photovoltaic cells, flexible electronics and energy efficient glass."

Applied Materials - Nanomanufacturing

Applied Materials' IP portfolio includes more than 8,000 patents worldwide and technologies. "They make the machines that make the chips".

Virtual Tour of Applied Materials Clean Room

A Virtual Tour of Applied Materials’ Clean Room

” Our machines harness plasma physics, chemistry and lots of computing power in order to fabricate nanoscale structures in the trillions, exactly the same, time after time after time. Many of our systems are developed at the Maydan Technology Center, located on our campus in Sunnyvale, California...."

Applied Materials
3050, Bowers Avenue, Santa Clara, CA 95054, USA

Monday, May 04, 2009

TSMC - Semiconductor Foundry

The Dedicated IC Foundry of TSMC is a foundation for logic IC innovations.It provides a complete range of services, including design and mask making services,].

TSMC - Semiconductor Foundry

TSMC currently operates three 12-inch GIGAFAB fabrication facilities.
Chip-On-Wafer-On-Substrate)

"TSMC has the broadest range of technologies and services in the Dedicated IC Foundry segment of the semiconductor manufacturing industry. The IC Industry Foundation strategy embodies an integrated approach that bundles process technology options and services."

TSMC's eFoundry

TSMC-Online is the first foundry delivery system to enable secure online business transactions and information transfer for creating product design, tape outs, and wafer tracking.

Chip-On-Wafer-On-Substrate

Through Silicon Via (TSV) technology to integrate multiple chips into a single device.

Higher density interconnects (lightens RC loading) resulting in enhanced performance (maybe RF too ?) and reduced power consumption in a smaller size.

Taiwan Semiconductor Manufacturing Company Limited
No. 8, Li-Hsin Rd. VI, Hsinchu Science Park, Hsinchu, Taiwan 300-78, R. O. C.

Saturday, September 01, 2007

CMP - Circuits Multi-Projets

CMP is a broker in ICs and MEMS for prototyping and low volume production. Circuits are fabricated for Universities, Research Laboratories and Industrial Companies.

CMP - Circuits Multi-Projets

CMP offers a complete assembly service based on a wide range of ceramic and plastic packages for prototypes and low volume production.

CMP also supplies Design tools and kits like : Tanner Tools, Leonardo - ModelSim, ARM Tools, SoftMEMS Tools and more.

A 3-4GHz All-Digital PLL for Frequency Synthesis in 65nm CMOS

3-4GHz All-Digital PLL for Frequency Synthesis

This chip contains a fractional-N PLL including a time/digital converter with calibration algorithms for fractional spur cancellation, a standard-cell-based digital filter and a low-noise voltage-controlled oscillator. It can synthesize frequencies from 3 to 4GHz with 600Hz resolution from a 40-MHz crystal reference, the loop bandwidth can be varied from 100kHz to 2MHz and it is intended for WiMAX transceivers.

Friday, February 09, 2007

Boin GmbH - Semiconductor Metrology Software

Boin GmbH - Semiconductor Metrology Software
 
Boin GmbH WAFERMAP
Metrology software for the semiconductor industry. Boin GmbH develops software solutions for the semiconductor industry and provides services such as the development of complex mathematical algorithms.

WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.

Boin GmbH
Haldenweg 25, 89160 Tomerdingen, Germany