Microcontroller - 8051, 8052, OpCodes, Analog Interface.

Monday, May 16, 2011

Micrel Semiconductors - Analog Mixed Ethernet and RF

Leading manufacturer of IC and Semiconductor solutions in analog, Ethernet and high bandwidth. Products include high performance analog, power, advanced mixed-signal and radio frequency semiconductors; high speed communication, clock management, Ethernet switch and physical layer transceiver integrated circuits

Micrel Semiconductors - Analog Mixed Ethernet and RF
 
The chips and devices are components of many consumer and industrial products. These are like Cellular handsets, portable and enterprise computing and networking, wide area networks and industrial equipment.
They also have a Foundry Service. In fiber optics they have Laser Diode Drivers and Optical Transceiver Mgmt. ARM based SOC's and USB products too are available.

MICRF213 QwikRadio 315 MHz Receiver

The MICRF213 functions as a super-heterodyne receiver for OOK and ASK modulation up to 7.2kbps. The down-conversion mixer also provides image rejection. All post-detection data filtering is provided on the chip.

Partial Specs
  • Up to -110dBm sensitivity, 1kbps and BER 10E-02
  • Frequency from 300MHz to 350MHz
  • Low current consumption: 3.9mA @ 315MHz,
  • Analog RSSI Output
Micrel Inc.
Founded 1978, Corporate headquarters in San Jose, California.

Address - 2180 Fortune Drive, San Jose, CA 95131, United States. - Micrel Map

Vitesse Semiconductor - Networking and Broadband

Designs and Manufactures high-performance semiconductor solutions for Carrier and Enterprise networks. These are applied in Networking Systems in Ethernet LAN, WAN, and RAN, Ethernet-over-SONET/SDH, Optical Transport (OTN), etc.

Vitesse Semiconductor - Networking and Broadband

They also have a range of versatile Signal Integrity, Physical Media Devices and Physical Layer Devices. Most of these products are enabling high speed data-communications and Ethernet Networking which are Moving towards better Energy Efficiency.

"pre-production silicon devices that fully support the newly ratified IEEE 802.3az-2010 Energy Efficient Ethernet (EEE) Standard for high density 8G-26G Ethernet switching solutions. Delivering power-saving features that exceed the IEEE's 802.3az Energy Efficient Ethernet standards...."

9.9 Gbps to 12.6 Gbps OC-192/FEC 16-Bit Demux with CRU

multiplexer demultiplexer chip set

The VSC1238 is a complete, high-performance, multiplexer/demultiplexer chip set designed for 9.9-12.5 Gbps applications, including SONET OC-192, SDH STM-64, 10GbE, G.975, G.709 and offering enhanced capabilities specifically designed to address the needs of Ultra Long Haul (ULH) and Long Haul (LH) fiber optic transmission systems.

Vitesse Semiconductor Corporation
741 Calle Plano Camarillo, CA 93012-8543 USA

Monday, May 09, 2011

MPC8569E for Broadband Access Equipment - Freescale

MPC8569E for Broadband Access Equipment - Freescale

MPC8569E Freescale
"The MPC8569E PowerQUICC III family is designed to address the increasing performance requirements for broadband access equipment including 3G/WiMAX/LTE base stations, radio network controllers, gateways and ATM/TDM/IP equipment."

Features Include
  • Embedded e500 core, scaling up to 1.33 GHz
  • 783-pin FC-PBGA package, 29 mm x 29 mm
  • 1.0V core voltage with 3.3V, 2.5V, 1.8V, 1.5V and 1.0V I/O
  • Dual I2C and Dual Universal Asynchronous Receiver/Transmitter (DUART) support
  • Integrated DDR memory controller with full ECC support
From Freescale Semiconductors - parent company - Motorola

Wednesday, May 04, 2011

ASIC - Application-Specific Integrated Circuits

This resource about ASICs is the pages that went into the "ASICs... the book". When you get to Mass Production or want to pack a lot of electronics into a small size, an ASIC is inevitable. It improves reliability and consistency in the manufactured gadgets. It is a justified process, when a device is needed in large numbers. For smaller numbers use Flash Programmable Embedded Devices.

ASIC - Application-Specific Integrated Circuits

by Michael John Sebastian Smith - Addison-Wesley Publishing Company - VLSI Design Series

ASIC - Application-Specific Integrated Circuits

"ICs are made on a thin (a few hundred microns thick), circular silicon wafer , with each wafer holding hundreds of die (sometimes people use dies or dice for the plural of die). The transistors and wiring are made from many layers (usually between 10 and 15 distinct layers) built on top of one another. Each successive mask layer has a pattern that is defined using a mask similar to a glass photographic slide. The first half-dozen or so layers define the transistors. The last half-dozen or so layers define the metal wires between the transistors (the interconnect )."